Stability analysis of electroplating formulations using DataPhysics MS 20 dispersion stability analysis system
Author(s)
DataPhysics

With the MultiScan 20 (MS 20) dispersion stability analysis system from DataPhysics stability changes can be detected and evaluated in a quantitative way much faster than any traditional shelflife test would permit.

In this application note, it is described how changes of the pH-value influence the stability of the liquid used for a copper electroplating bath.